Role and Selection of Polymer Activities for Aerospace Boards

Abstract

Polymer activities encompassing masking, potting, staking, bonding, coating , dam and fill operations are important for reliable package realization. The selection of the material is important for the card as well as subsystem level as the performance can be compromised eventually leading to failure of the system. In aerospace and defense systems compared to other general electronic boards considerations of temperature and radiation are the key parameters for the selection of the material. This article details the overview of the standard material, selection of various polymer materials, material characterization aspect taken into consideration before implementation in the high reliability boards.